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Lithography - ultratech

Lithography - ultratech

Wafer Size:  3", 4", 5", 6", or 8"

Loader type: Automation/Manual

Computer: HP 362

Depth of Focus: 3.0 ums @1.0um lines

Depth of Focus: 7.0 ums @1.4um lines

Uniformity: 3%

Reticle Size 3" x 5" x 0.090"

Maximum Area 34.2 x 13.6 mm

Maximum Aspect: 39 x 11.4 mm

High wafer plane irradiance

Maximum Square 18 x 18 mm

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